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capabilities

In our additive manufacturing plant, we use three types of technology to produce parts from liquid resin, powder bed melting, and metal sintering.

Our wide range of technologies allow us to increase productivity and always give our customers the best response.
 

Estereolitografía láser

SLA

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Multijet fusion

MJF

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Sinterizado laser metálico

 SLM / LMF

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Stereolithography, SLA, is an additive manufacturing process that uses UV curing resin in a tank, and an UV laser to build the objects.
The liquid resin is solidified by exposure to laser ultraviolet light, thus leaving the newly solidified layer stuck to the previous layer that existed below it.

Manufacturing size

145 × 145 × 175mm

Delivery time

From 72 hours

Tolerance

±0.0.8% (min: ±0.04mm)

min size part

1x1x7mm

layer height

25-300μm

Minimal thickness

1mm

MJF technology bonds agent and powder in a similar way to the binder jetting process, but unlike a point-by-point laser-based system, MJF is designed to distribute details and melting agents throughout the entire bed selectively.

So these layers are fused together using what is called infrared light; as a result you get a higher speed combined with a higher accuracy compared to SLS

Manufacturing size

380x380x280

Delivery time

from 48 hours

Tolerance

±0.3% (min: ±0.15mm)

min size part

1x1x8mm

layer height

60-80μm

Minimal thickness

0.5mm

Selective Laser Melting (SLM) Powder bed melting is the leading technology for manufacturing precision metal objects with complex geometries.

There are different processes depending on the heat source used (laser or electron beam) and the degree of fusion of the material (sintered or fusion).

Manufacturing size

250 × 250 × 320mm

Delivery time

From 72 hours

Tolerance

±0.0.8% (min: ±0.04mm)

min size part

2x2x8mm

layer height

25-300μm

Minimal thickness

1mm

Additional internal capabilities

- Muffle furnace (Thermal treatments)

-  4-axis machining

- Ultrasonic cleaning

external capabilities

-EDM

-  5-axis machining

- Welding

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